Invention Grant
- Patent Title: Non-volatile memory device and method of fabricating the same
- Patent Title (中): 非易失性存储器件及其制造方法
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Application No.: US11734659Application Date: 2007-04-12
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Publication No.: US07812375B2Publication Date: 2010-10-12
- Inventor: Chang-Hyun Lee , Tea-Kwang Yu , Jong-Sun Sel , Ju-Hyung Kim , Byeong-In Choe
- Applicant: Chang-Hyun Lee , Tea-Kwang Yu , Jong-Sun Sel , Ju-Hyung Kim , Byeong-In Choe
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2006-0046287 20060523; KR10-2006-0130382 20061219
- Main IPC: H01L31/112
- IPC: H01L31/112 ; H01L21/336

Abstract:
In the non-volatile memory device, a first isolation layer is formed to have a plurality of depressions each having a predetermined depth from an upper surface of the semiconductor substrate. A fin type first active region is defined by the first isolation layer and has one or more inflected portions at its sidewalls exposed from the first isolation layer, where the first active region is divided into an upper part and a lower part by the inflected portions and a width of the upper part is narrower than that of the lower part. A tunneling insulation layer is formed on the first active region. A storage node layer is formed on the tunneling insulation layer. Also, a blocking insulation layer is formed on the storage node layer, and a control gate electrode is formed on the blocking insulation layer.
Public/Granted literature
- US20070272971A1 Non-Volatile Memory Device and Method of Fabricating the Same Public/Granted day:2007-11-29
Information query
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