Invention Grant
- Patent Title: Electronic package device, module, and electronic apparatus
- Patent Title (中): 电子封装器件，模块和电子设备
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Application No.: US12223963Application Date: 2007-02-28
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Publication No.: US07812440B2Publication Date: 2010-10-12
- Inventor: Takao Yamazaki , Yoshimichi Sogawa , Toshiaki Shironouchi , Kenji Ohyachi
- Applicant: Takao Yamazaki , Yoshimichi Sogawa , Toshiaki Shironouchi , Kenji Ohyachi
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2006-061237 20060307
- International Application: PCT/JP2007/053724 WO 20070228
- International Announcement: WO2007/102358 WO 20070913
- Main IPC: H01L23/053
- IPC: H01L23/053
Abstract:
There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrate 3 includes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film 7) is formed to increase strength of the wiring pattern.
Public/Granted literature
- US20090065921A1 Electronic Package Device, Module, and Electronic Apparatus Public/Granted day:2009-03-12
Information query
IPC分类:
