Invention Grant
US07812767B2 Antenna device, array antenna device using the antenna device, module, module array and package module
有权
天线装置，使用天线装置的阵列天线装置，模块，模块阵列和封装模块
- Patent Title: Antenna device, array antenna device using the antenna device, module, module array and package module
- Patent Title (中): 天线装置，使用天线装置的阵列天线装置，模块，模块阵列和封装模块
-
Application No.: US11660621Application Date: 2005-09-07
-
Publication No.: US07812767B2Publication Date: 2010-10-12
- Inventor: Tomohiro Seki , Kenjiro Nishikawa , Naoki Honma , Kouichi Tsunekawa
- Applicant: Tomohiro Seki , Kenjiro Nishikawa , Naoki Honma , Kouichi Tsunekawa
- Applicant Address: JP Tokyo
- Assignee: Nippon Telegraph and Telephone Corporation
- Current Assignee: Nippon Telegraph and Telephone Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2004-260038 20040907; JP2005-178001 20050617
- International Application: PCT/JP2005/016424 WO 20050907
- International Announcement: WO2006/028136 WO 20060316
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q13/06 ; H01Q15/14
Abstract:
A small antenna device having an increased gain is provided. The antenna device includes a multilayer dielectric substrate composed of a combination of a plurality of dielectric layers, wherein a feeding antenna is provided in a lower layer of the multilayer substrate, a reflective metal plate is provided above the feeding antenna, and circular or rectangular metal loops are arranged so as to be of increasing diameter from lower layers toward upper layers in the plurality of dielectric layers.
Public/Granted literature
- US20080042917A1 Antenna Device, Array Antenna Device Using the Antenna Device, Module, Module Array and Package Module Public/Granted day:2008-02-21
Information query
