Invention Grant
- Patent Title: Electronic device and heat dissipation unit thereof
- Patent Title (中): 电子设备及其散热单元
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Application No.: US12393947Application Date: 2009-02-26
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Publication No.: US07813130B2Publication Date: 2010-10-12
- Inventor: Ming Yuan Ho
- Applicant: Ming Yuan Ho
- Applicant Address: TW Peitou, Taipei
- Assignee: ASUSTeK Computer Inc.
- Current Assignee: ASUSTeK Computer Inc.
- Current Assignee Address: TW Peitou, Taipei
- Agent Winston Hsu; Scott Margo; Min-Lee Teng
- Priority: TW97116615A 20080506
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation unit is provided. The heat dissipation unit includes a heat sink, a first fixing station, a first heat pipe, a second fixing station and a second heat pipe. The first fixing station is located on a first plane. The first heat pipe is connected to the first fixing station and the heat sink. The second fixing station is located on a second plane, wherein a gap is formed between the first plane and the second plane. The second heat pipe is connected to the second fixing station and the heat sink, wherein the first fixing station partially overlaps the second fixing station.
Public/Granted literature
- US20090279264A1 ELECTRONIC DEVICE AND HEAT DISSIPATION UNIT THEREOF Public/Granted day:2009-11-12
Information query
