Invention Grant
US07813204B2 Method and system for memory thermal load sharing using memory on die termination
有权
使用存储器进行存储器热负载共享的方法和系统
- Patent Title: Method and system for memory thermal load sharing using memory on die termination
- Patent Title (中): 使用存储器进行存储器热负载共享的方法和系统
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Application No.: US12005968Application Date: 2007-12-28
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Publication No.: US07813204B2Publication Date: 2010-10-12
- Inventor: David G. Reed , Brad W. Simeral , Roman Surgutchik , Joshua Titus
- Applicant: David G. Reed , Brad W. Simeral , Roman Surgutchik , Joshua Titus
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G11C7/04
- IPC: G11C7/04
Abstract:
Memory component temperature information is used to implement a method for ODT (on die termination) thermal load management. A respective temperature of a plurality of memory components are accessed, and based on this temperature, an ODT cycle is directed to a first of the memory components to avoid imposing a thermal load from the ODT cycle on a second of the memory components.
Public/Granted literature
- US20090083506A1 Method and system for memory thermal load sharing using memory on die termination Public/Granted day:2009-03-26
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