Invention Grant
- Patent Title: Speaker module design
- Patent Title (中): 扬声器模块设计
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Application No.: US11838846Application Date: 2007-08-14
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Publication No.: US07813770B2Publication Date: 2010-10-12
- Inventor: San-Chi Ho , Kar-Chai Luk , Teerada Sirirattanasit
- Applicant: San-Chi Ho , Kar-Chai Luk , Teerada Sirirattanasit
- Applicant Address: TW Taoyuan County
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan County
- Agency: J.C. Patents
- Priority: TW92201050U 20030121
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A speaker module and a mobile device having the speaker module are provided herein. The speaker module includes a speaker unit and a speaker box. The speaker box has a wall defining an aperture receiving the speaker unit therein. The speaker box has a first speaker chamber, a second speaker chamber and a connecting section connecting the first speaker chamber and the second speaker chamber. The cross-sectional height of the space of the connecting section is lower than that of the first speaker chamber or the second speaker chamber. In other option, the space of the connecting section is smaller than that of the first speaker chamber or the second speaker chamber.
Public/Granted literature
- US20070275769A1 SPEAKER MODULE DESIGN Public/Granted day:2007-11-29
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