Invention Grant
- Patent Title: Memory module packaging test system
- Patent Title (中): 内存模块封装测试系统
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Application No.: US11812578Application Date: 2007-06-20
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Publication No.: US07814379B2Publication Date: 2010-10-12
- Inventor: Jung-kuk Lee , You-keun Han , Hui-chong Shin
- Applicant: Jung-kuk Lee , You-keun Han , Hui-chong Shin
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0065868 20060713
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G01R31/02

Abstract:
A memory module packaging test system may include a plurality of test slots into which a plurality of memory modules may be installed so that the system may simultaneously test the memory modules. The memory module packaging test system may use a server system for a registered dual in-line memory module (RDIMM) or a fully buffered dual in-line memory module (FBDIMM) so that the system may test an unbuffered dual in-line memory module (UDIMM).
Public/Granted literature
- US20080016400A1 Memory module packaging test system Public/Granted day:2008-01-17
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