In one embodiment, an interface module is provided for connecting a plurality of signal paths to a high signal density interface. The interface module includes a board having axial conductor receptacles. The axial conductor receptacles have at least one ground via extending through the board to an interface side of the board and a shield receiving hole in the board extending into the board from a cable side of the board. At least a portion of the at least one ground via being exposed within the shield receiving hole, the shield receiving hole having a plating therein contacting the portion of the at least one ground via exposed within the shield receiving hole. The axial conductor receptacles have a plated center conductor receiving hole in the board, which extends to a signal via. The signal via extends from the center conductor hole to the interface side of the board. A non-plated hole in the board is located between the plated center conductor hole and the shield receiving hole.