Invention Grant
- Patent Title: Three-dimensional plated support frame
- Patent Title (中): 三维电镀支架
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Application No.: US12340144Application Date: 2008-12-19
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Publication No.: US07815475B2Publication Date: 2010-10-19
- Inventor: Kirk B. Peloza , Victor Zaderej , John Dolaz , Stephen Rushing
- Applicant: Kirk B. Peloza , Victor Zaderej , John Dolaz , Stephen Rushing
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- Main IPC: H01R13/02
- IPC: H01R13/02 ; H01R9/24

Abstract:
A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.
Public/Granted literature
- US20090163045A1 PLATED DIELECTRIC FRAME WITH INTEGRATED CONNECTOR Public/Granted day:2009-06-25
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