Invention Grant
- Patent Title: Conductive polymer foams, method of manufacture, and uses thereof
- Patent Title (中): 导电聚合物泡沫,其制造方法及其应用
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Application No.: US12027018Application Date: 2008-02-06
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Publication No.: US07815998B2Publication Date: 2010-10-19
- Inventor: Scott Simpson , Ki-Soo Kim , Jason Hoffman
- Applicant: Scott Simpson , Ki-Soo Kim , Jason Hoffman
- Applicant Address: US IL Lincolnwood
- Assignee: World Properties, Inc.
- Current Assignee: World Properties, Inc.
- Current Assignee Address: US IL Lincolnwood
- Agency: Cantor Colburn LLP
- Main IPC: B32B5/22
- IPC: B32B5/22 ; H05B6/00

Abstract:
Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of magnetic, electrically conductive particles aligned into a plurality of mutually isolated chains that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.
Public/Granted literature
- US20080213565A1 Conductive Polymer Foams, Method of Manufacture, and Uses Thereof Public/Granted day:2008-09-04
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