Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12500912Application Date: 2009-07-10
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Publication No.: US07816201B2Publication Date: 2010-10-19
- Inventor: Yoshiko Kato , Shigeru Ishibashi , Mitsuhiro Noguchi
- Applicant: Yoshiko Kato , Shigeru Ishibashi , Mitsuhiro Noguchi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-036869 20060214
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A semiconductor device according to an example of the present invention includes a first semiconductor region of a first conductivity type, a first MIS transistor of a second conductivity type formed in the first semiconductor region, a second semiconductor region of a second conductivity type, and a second MIS transistor of a first conductivity type formed in the second semiconductor region. A first gate insulating layer of the first MIS transistor is thicker than a second gate insulating layer of the second MIS transistor, and a profile of impurities of the first conductivity type in a channel region of the second MIS transistor has peaks.
Public/Granted literature
- US20090275181A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-11-05
Information query
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