Invention Grant
- Patent Title: Wood preservative composition
- Patent Title (中): 木材防腐剂组成
-
Application No.: US11715570Application Date: 2007-03-08
-
Publication No.: US07816343B2Publication Date: 2010-10-19
- Inventor: Mark C. Hoffman
- Applicant: Mark C. Hoffman
- Applicant Address: US WI Medford
- Assignee: HWD Acquisition, Inc.
- Current Assignee: HWD Acquisition, Inc.
- Current Assignee Address: US WI Medford
- Agency: Merchant & Gould P.C.
- Main IPC: A01N59/14
- IPC: A01N59/14 ; A01N55/08 ; A01N43/653 ; A01N47/10 ; A01N37/08

Abstract:
A wood preservative composition comprising a mixture of a fungicide which is a combination of a boric acid ester, which is soluble in an organic solvent and has a sterically hindered di-alcohol or tri-alcohol group, such as trihexylene glycol biborate, an organo-iodine compound, a triazole, and a synthetic pyrethroid insecticide, said fungicide and the insecticide being present in a sufficient amount that wood treated with the wood treatment material contains fungicide and insecticide in an amount of about 1 ppm to 5000 ppm, based on the weight of the wood after treatment.
Public/Granted literature
- US20080221067A1 Wood preservative composition Public/Granted day:2008-09-11
Information query