Invention Grant
US07816487B2 Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
有权
用于芯片级封装的芯片附着膜，由其制成的封装及其组装方法
- Patent Title: Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
- Patent Title (中): 用于芯片级封装的芯片附着膜，由其制成的封装及其组装方法
-
Application No.: US10956624Application Date: 2004-09-30
-
Publication No.: US07816487B2Publication Date: 2010-10-19
- Inventor: Rahul N. Manepalli , Ravindra V. Tanikella
- Applicant: Rahul N. Manepalli , Ravindra V. Tanikella
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L21/56
- IPC: H01L21/56
Abstract:
A die-attach composition includes a resin such as a thermosetting resin, a hardener, and a low molecular weight oligomer diluent. A die-attach composition includes a polyimide in a major amount and a resin such as a thermosetting resin in a minor amount. The die-attach composition also includes a reactive polymer diluent. Combinations of the low molecular weight oligomer diluent and the reactive polymer diluent are included. The die-attach composition is applied to surface mount technology such as wire-bond dice. A computing system is also included that uses the die-attach composition.
Public/Granted literature
- US20060073624A1 Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same Public/Granted day:2006-04-06
Information query
IPC分类:
