Invention Grant
- Patent Title: Metal-containing compound, its production method, metal-containing thin film, and its formation method
- Patent Title (中): 含金属化合物,其制备方法,含金属薄膜及其形成方法
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Application No.: US11997819Application Date: 2006-07-28
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Publication No.: US07816549B2Publication Date: 2010-10-19
- Inventor: Ken-ichi Tada , Koichiro Inaba , Taishi Furukawa , Tetsu Yamakawa , Noriaki Oshima
- Applicant: Ken-ichi Tada , Koichiro Inaba , Taishi Furukawa , Tetsu Yamakawa , Noriaki Oshima
- Applicant Address: JP Shunan-Shi JP Ayase-Shi
- Assignee: Tosoh Corporation,Sagami Chemical Research Center
- Current Assignee: Tosoh Corporation,Sagami Chemical Research Center
- Current Assignee Address: JP Shunan-Shi JP Ayase-Shi
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-226886 20050804; JP2005-326883 20051111; JP2005-326884 20051111
- International Application: PCT/JP2006/315037 WO 20060728
- International Announcement: WO2007/015436 WO 20070208
- Main IPC: C07F7/00
- IPC: C07F7/00 ; C07F5/06 ; C23C16/00

Abstract:
A compound which has thermal stability and moderate vaporizability and is satisfactory as a material for the CVD or ALD method; a process for producing the compound; a thin film formed from the compound as a raw material; and a method of forming the thin film. A compound represented by the general formula (1) is produced by reacting a compound represented by the general formula (2) with a compound represented by the general formula (3). The compound produced is used as a raw material to form a metal-containing thin film. [Chemical formula 1] (1) [Chemical formula 2] (2) [Chemical formula 3] Mp(NR4R5)q(3) (In the formulae, M represents a Group 4 element, aluminum, gallium, etc.; n is 2 or 3 according to cases; R1 and R3 each represents C1-6 alkyl, etc.; R2 represents C1-6 alkyl, etc.; R4 and R5 each represents C1-4 alkyl, etc.; X represents hydrogen, lithium, or sodium; p is 1 or 2 according to cases; and q is 4 or 6 according to cases).
Public/Granted literature
- US20100105936A1 METAL-CONTAINING COMPOUND, ITS PRODUCTION METHOD, METAL-CONTAINING THIN FILM, AND ITS FORMATION METHOD Public/Granted day:2010-04-29
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