Invention Grant
- Patent Title: Drum pad and manufacturing method thereof
- Patent Title (中): 鼓垫及其制造方法
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Application No.: US12414064Application Date: 2009-03-30
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Publication No.: US07816597B2Publication Date: 2010-10-19
- Inventor: Masuhiro Okada , Shuichi Sawada
- Applicant: Masuhiro Okada , Shuichi Sawada
- Applicant Address: JP
- Assignee: Yamaha Corporation
- Current Assignee: Yamaha Corporation
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2008-089284 20080331
- Main IPC: G10D13/02
- IPC: G10D13/02

Abstract:
A drum pad has a knitted material that is strechable and has a top surface to be beaten by a stick and a rear surface opposite to the top surface, a resin member that is strechable and thinner than the knitted material and that is capable of being thermally fused and bonded to the knitted material, and a rubber. The drum pad is formed of a first layer portion, a second layer portion, and a body portion. The first layer portion is formed in a region of the knitted material including the top surface thereof but not including the rear surface. The body portion is formed of the rubber. The second layer portion is formed in a remaining region of the knitted material other than the first layer portion and formed between the body portion and the first layer portion.
Public/Granted literature
- US20090241754A1 DRUM PAD AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-10-01
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