Invention Grant
- Patent Title: Method for packaging a light emitting device including a metal reflection layer and a metal heat dissipation layer
- Patent Title (中): 包括金属反射层和金属散热层的发光装置的方法
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Application No.: US12292054Application Date: 2008-11-12
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Publication No.: US07816704B2Publication Date: 2010-10-19
- Inventor: Tsang-Lin Hsu , Heng-I Lin
- Applicant: Tsang-Lin Hsu , Heng-I Lin
- Applicant Address: TW Taipei Hsien
- Assignee: Liung Feng Industrial Co., Ltd.
- Current Assignee: Liung Feng Industrial Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agency: Rosenberg, Klein & Lee
- Priority: TW97111139A 20080327
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/44 ; H01L33/00
Abstract:
A method for packaging a light emitting element includes a step of providing a carrier formed with an anode electrode and a cathode electrode, a step of providing a light emitting object by utilizing a light emitting diode chip having a positive and negative electrodes, a step of directly contacting the carrier and the light emitting diode chip to establish electrical communication among the anode and cathode electrodes and the positive and negative electrodes, and a step of firmly bonding the carrier and the light emitting diode chip by which to simplify assembling procedure and further to reduce manufacturing cost and enhance production efficiency.
Public/Granted literature
- US20090242916A1 Method for packaging a light emitting device Public/Granted day:2009-10-01
Information query
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