Invention Grant
- Patent Title: Semiconductor device using SiGe for substrate
- Patent Title (中): 半导体器件采用SiGe作为衬底
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Application No.: US11619799Application Date: 2007-01-04
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Publication No.: US07816739B2Publication Date: 2010-10-19
- Inventor: Hirohisa Kawasaki
- Applicant: Hirohisa Kawasaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-001812 20060106
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
A semiconductor device includes a first semiconductor layer, an n-type/p-type second semiconductor layer, p-type/n-type third semiconductor layers and a first gate electrode. The second semiconductor layer is formed on the first semiconductor layer and has an oxidation rate which is lower than that of the first semiconductor layer. The third semiconductor layers are formed in the second semiconductor layer and have a depth reaching an inner part of the first semiconductor layer. In case that the second and third semiconductor layers are n-type and p-type, respectively, a lattice constant of the second semiconductor layer is less than that of the third semiconductor layer. In case that the second and third semiconductor layers are p-type and n-type, respectively, the lattice constant of the second semiconductor layer is greater than that of the third semiconductor layer. A first gate electrode is formed on the second semiconductor layer.
Public/Granted literature
- US20070164364A1 SEMICONDUCTOR DEVICE USING SIGE FOR SUBSTRATE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2007-07-19
Information query
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