Invention Grant
- Patent Title: Wafer level hermetically sealed MEMS device
- Patent Title (中): 晶圆级气密密封的MEMS器件
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Application No.: US11066820Application Date: 2005-02-25
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Publication No.: US07816745B2Publication Date: 2010-10-19
- Inventor: Rogier Receveur , Cornel Marxer
- Applicant: Rogier Receveur , Cornel Marxer
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
A hermetically sealed microelectromechanical system (MEMS) package includes a MEMS switch having a movable portion and a stationary portion with an electrical contact thereon. A glass lid is anodically bonded to the MEMS switch to form a sealed cavity over the movable portion of the MEMS switch. The glass lid includes a contact aperture to allow access to the electrical contact on the stationary portion of the MEMS switch. A family of body-implantable hermetically-sealed MEMS packages are provided according to certain aspects and embodiments of the present invention.
Public/Granted literature
- US20060192272A1 Wafer level hermetically sealed MEMS device Public/Granted day:2006-08-31
Information query
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