Invention Grant
- Patent Title: Semiconductor-element mounting substrate, semiconductor device, and electronic equipment
- Patent Title (中): 半导体元件安装基板，半导体器件和电子设备
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Application No.: US11607001Application Date: 2006-12-01
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Publication No.: US07816777B2Publication Date: 2010-10-19
- Inventor: Masanori Minamio , Noboru Takeuchi , Kenichi Itou , Toshiyuki Fukuda , Hideki Sakota
- Applicant: Masanori Minamio , Noboru Takeuchi , Kenichi Itou , Toshiyuki Fukuda , Hideki Sakota
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-001586 20060106
- Main IPC: H01L21/48
- IPC: H01L21/48
Abstract:
A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.
Public/Granted literature
- US20070158855A1 Semiconductor-element mounting substrate, semiconductor device, and electronic equipment Public/Granted day:2007-07-12
Information query
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