Invention Grant
- Patent Title: Laminated inductor
- Patent Title (中): 层压电感
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Application No.: US12194935Application Date: 2008-08-20
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Publication No.: US07817007B2Publication Date: 2010-10-19
- Inventor: Byoung Hwa Lee , Sung Kwon Wi , Hyeog Soo Shin , Dong Seok Park , Sang Soo Park , Min Cheol Park
- Applicant: Byoung Hwa Lee , Sung Kwon Wi , Hyeog Soo Shin , Dong Seok Park , Sang Soo Park , Min Cheol Park
- Applicant Address: KR Gyunggi-do
- Assignee: Sumitomo Electro-Mechanics Co., Ltd.
- Current Assignee: Sumitomo Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2007-0083545 20070820
- Main IPC: H01F5/00
- IPC: H01F5/00

Abstract:
There is provided a laminated inductor including: a body where a plurality of magnetic layers are laminated; a coil part formed on the magnetic layers, the coil part including a plurality of conductor patterns and a plurality of conductive vias; first and second external electrodes formed on an outer surface of the body to connect to both ends of the coil part, respectively; and a non-magnetic conductor formed on at least one of the magnetic layers so as to relax magnetic saturation caused by direct current flowing through the coil part. The laminated inductor employs the non-magnetic conductor as a non-magnetic gap to be simplified in a manufacturing process and effectively improved in DC superposition characteristics.
Public/Granted literature
- US20090051474A1 LAMINATED INDUCTOR Public/Granted day:2009-02-26
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