Invention Grant
- Patent Title: Flexible airflow baffle for an electronic system
- Patent Title (中): 柔性气流挡板用于电子系统
-
Application No.: US12253781Application Date: 2008-10-17
-
Publication No.: US07817417B2Publication Date: 2010-10-19
- Inventor: John P Franz , Richard A. Bargerhuff , David A. Selvidge
- Applicant: John P Franz , Richard A. Bargerhuff , David A. Selvidge
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20
Abstract:
A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors.
Public/Granted literature
- US20100097758A1 FLEXIBLE AIRFLOW BAFFLE FOR AN ELECTRONIC SYSTEM Public/Granted day:2010-04-22
Information query
