Invention Grant
- Patent Title: Heat sink assembly including a heat pipe and a duct
- Patent Title (中): 散热器组件,包括热管和管道
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Application No.: US12240028Application Date: 2008-09-29
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Publication No.: US07817424B2Publication Date: 2010-10-19
- Inventor: Yu-Ling Jiang , Zhi-Jiang Yao , Ning-Yu Wang
- Applicant: Yu-Ling Jiang , Zhi-Jiang Yao , Ning-Yu Wang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Clifford O. Chi
- Priority: CN200820301461 20080707
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/20 ; H01L23/34 ; F28F7/00

Abstract:
A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.
Public/Granted literature
- US20100002390A1 HEAT SINK ASSEMBLY Public/Granted day:2010-01-07
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