Invention Grant
- Patent Title: Communicating with an electronic module that is slidably mounted in a system
- Patent Title (中): 与可滑动地安装在系统中的电子模块通信
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Application No.: US12043490Application Date: 2008-03-06
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Publication No.: US07817432B2Publication Date: 2010-10-19
- Inventor: Christian L. Belady , Eric C. Peterson
- Applicant: Christian L. Belady , Eric C. Peterson
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A system comprises an electronic module slidably mounted in the system, a first assembly including at least one wireless transceiver mounted in the system, and a second assembly including at least one wireless transceiver to communicate wirelessly with the wireless transceiver of the first assembly. The second assembly is attached to the electronic module, and the wireless transceivers of the first and second assemblies continue communicating as the electronic module is slidably moved in the system.
Public/Granted literature
- US20080165507A1 Communicating with an Electronic Module that is Slidably Mounted in a System Public/Granted day:2008-07-10
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