Invention Grant
- Patent Title: Electrical connector assembly having improved substrate
- Patent Title (中): 具有改进的衬底的电连接器组件
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Application No.: US12506447Application Date: 2009-07-21
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Publication No.: US07819699B2Publication Date: 2010-10-26
- Inventor: Yong-Chun Xu , Hong-Bo Zhang
- Applicant: Yong-Chun Xu , Hong-Bo Zhang
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Priority: CN200820041960.2 20080721
- Main IPC: H01R13/66
- IPC: H01R13/66

Abstract:
An electrical connector assembly has an insulative housing (2) defining a number of receiving spaces (24) and a number of contact modules (4) inserted in the receiving spaces. Each contact module comprises a first substrate (41) having a pair of substrate halves (411), and a pair of conductive units respectively mounted on corresponding substrate halves. The first substrate has a number of circuit traces formed thereon and one electronic component (415) disposed on one substrate half. The circuit traces is electrically connected with the pair of conductive units and the electronic component. The pair of conductive units share the electronic component commonly via the circuit traces.
Public/Granted literature
- US20100015852A1 ELECTRICAL CONNECTOR ASSEMBLY HAVING IMPROVED SUBSTRATE Public/Granted day:2010-01-21
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