A thermal management circuit board comprises a heat sink, at least one insulating layer and at least one electronic circuit. The heat sink comprises a heat conducting material having tooling holes disposed therethrough and raised portions disposed on at least one surface thereof. The raised portions of the heat sink provide mounting surfaces for heat producing electronic components on a plane above a chemically etched surface of the heat sink. The electronic circuit comprises a prepreg and a circuit material wherein the circuit material is laminated to the prepreg, has a photoresist laid thereupon with at least one circuit image printed thereupon. The photoresist is then developed and the circuit material is chemically etched to define a circuit trace of the electronic circuit. The insulating layer comprises a thermally and electrically resistant material and has apertures disposed therethrough corresponding in size and shape to the raised portions of the heat sink. The circuit trace has an upper surface for receiving surface mount electronic components thereupon and the electronic circuit also has apertures disposed therethrough corresponding in size and location to the raised portions of the heat sink. The insulating layer, the electronic circuit and the heat sink are laminated together with heat and pressure with the raised portions disposed through the apertures wherein the plane of the mounting surfaces of the heat sink is on the same plane as the upper surface of the circuit trace of the electronic circuit.