Invention Grant
- Patent Title: Carrier tape, electronic-component accommodating member and method of transporting electronic component
- Patent Title (中): 载带,电子部件容纳部件和运送电子部件的方法
-
Application No.: US12036742Application Date: 2008-02-25
-
Publication No.: US07828152B2Publication Date: 2010-11-09
- Inventor: Yuuzou Hamanaka , Yukio Ando , Keiichi Sasamura , Kenichi Yazaki , Yuuji Hasegawa , Kouichi Shinya
- Applicant: Yuuzou Hamanaka , Yukio Ando , Keiichi Sasamura , Kenichi Yazaki , Yuuji Hasegawa , Kouichi Shinya
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-044545 20070223
- Main IPC: B65D85/00
- IPC: B65D85/00

Abstract:
The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes.In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.
Public/Granted literature
- US20080202981A1 CARRIER TAPE, ELECTRONIC-COMPONENT ACCOMMODATING MEMBER AND METHOD OF TRANSPORTING ELECTRONIC COMPONENT Public/Granted day:2008-08-28
Information query
IPC分类: