Invention Grant
- Patent Title: Reduction kiln
- Patent Title (中): 还原窑
-
Application No.: US11657680Application Date: 2007-01-23
-
Publication No.: US07828548B2Publication Date: 2010-11-09
- Inventor: Ronald K. Riddle
- Applicant: Ronald K. Riddle
- Applicant Address: DK
- Assignee: FLSmidth A/S
- Current Assignee: FLSmidth A/S
- Current Assignee Address: DK
- Agent Daniel DeJoseph; Aaron Pile
- Main IPC: C22B1/00
- IPC: C22B1/00

Abstract:
Disclosed is a process for reducing metallic oxide or sulfide materials in a rotary kiln and a rotary kiln for reducing such materials. The materials are heated in a reducing atmosphere as they travel along the axial length of the rotary kiln. The materials are discharged from the kiln at a discharge point in the kiln away from its lower material outlet end, wherein the temperature within the kiln at said discharge point is greater than the temperature at the lower material outlet end.
Public/Granted literature
- US20080176178A1 Reduction kiln Public/Granted day:2008-07-24
Information query