Disclosed herein is a test and burn-in socket for integrated circuits. The socket includes a socket body (37). A lead guide (36) is provided under the socket body. A slide (35) is mounted to the socket body to move horizontally. A plurality of slide springs (39) is elastically supported between the slide and the socket body, thus allowing the slide to smoothly restore an original position thereof. A contact guide (31) is provided above the slide to guide positions of upper contact terminals of contacts. An IC guide (30) is provided above the contact guide to guide a position of an IC. A cover (21) is provided to move vertically from the socket body (37). A latch (29) presses the IC. The socket also includes the contacts (33).