Invention Grant
- Patent Title: Cable assembly with improved grounding structure
- Patent Title (中): 电缆组件具有改进的接地结构
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Application No.: US12384753Application Date: 2009-04-08
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Publication No.: US07828589B2Publication Date: 2010-11-09
- Inventor: Yung-Chang Cheng
- Applicant: Yung-Chang Cheng
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Priority: CN200810023586 20080408
- Main IPC: H01R12/24
- IPC: H01R12/24

Abstract:
A cable assembly includes an electrical connector and a cable. The electrical connector includes an insulative housing having a first wall and a second wall, and a plurality of contacts received in the housing and at least a shell attached on the first wall of the housing. The cable includes at least a grounding wire and a plurality of signal wires connected to their corresponding contacts received in the housing. The shell includes at least a grounding portion extending from the shell and located between the shell and the second wall of the housing. The grounding portion includes a strain relief and a crimping portion. The grounding wire includes an inner contact crimped by the crimping portion and an insulative jacket crimped by the strain relief.
Public/Granted literature
- US20090253291A1 Cable assembly with improved grounding structure Public/Granted day:2009-10-08
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