Invention Grant
US07828849B2 Expanding interbody implant and articulating inserter and method 有权
扩大椎间植入物和关节插入物和方法

  • Patent Title: Expanding interbody implant and articulating inserter and method
  • Patent Title (中): 扩大椎间植入物和关节插入物和方法
  • Application No.: US10763115
    Application Date: 2004-01-22
  • Publication No.: US07828849B2
    Publication Date: 2010-11-09
  • Inventor: Roy K Lim
  • Applicant: Roy K Lim
  • Applicant Address: US IN Warsaw
  • Assignee: Warsaw Orthopedic, Inc.
  • Current Assignee: Warsaw Orthopedic, Inc.
  • Current Assignee Address: US IN Warsaw
  • Main IPC: A61F2/44
  • IPC: A61F2/44 A61B17/70
Expanding interbody implant and articulating inserter and method
Abstract:
A device for processing vertebral members having a spacer, a delivery device, and a deployer. The spacer includes at least first and second members with the first having at least one angled section and a contact surface, a second member having at least one angled section and a contact surface. The delivery device is attached to at least one of the first and second members. The first and second members being movable relative to one another for the angled sections to contact and expand the height of the device. The device is positionable between a first closed orientation having a first height, a second open orientation having a second height greater than the first height, and gradations therebetween. Methods of spacing vertebral members using the spacer are also disclosed.
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