Invention Grant
- Patent Title: Copper microparticle and process for producing the same
- Patent Title (中): 铜微粒及其制造方法
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Application No.: US11660102Application Date: 2005-08-18
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Publication No.: US07828872B2Publication Date: 2010-11-09
- Inventor: Masanori Tomonari , Masatoshi Honma , Yoshiyuki Kunifusa
- Applicant: Masanori Tomonari , Masatoshi Honma , Yoshiyuki Kunifusa
- Applicant Address: JP Osaka
- Assignee: Ishihara Sangyo Kaisha, Ltd.
- Current Assignee: Ishihara Sangyo Kaisha, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Manelli Denison & Selter, PLLC
- Agent Paul E. White, Jr.
- Priority: JP2004-241540 20040820; JP2004-241541 20040820
- International Application: PCT/JP2005/015087 WO 20050818
- International Announcement: WO2006/019144 WO 20060223
- Main IPC: B22F9/20
- IPC: B22F9/20

Abstract:
There is provided a process comprising mixing a divalent copper oxide with a reducing agent in the presence of a complexing agent and a protective colloid in a liquid medium to thereby produce copper microparticles without formation of a univalent copper oxide from the divalent copper oxide. Further, there is provided a process comprising reducing a divalent copper oxide in the presence of a complexing agent and a protective colloid, such as a protein, to thereby form metallic copper microparticles, adding a protective colloid scavenger, such as a protease, to thereby remove the protective colloid and effect agglomeration of metallic copper microparticles, and filtering the mixture by means of a pressure filter, a vacuum filter, a suction filter, etc.
Public/Granted literature
- US20080148904A1 Copper Microparticle and Process for Producing the Same Public/Granted day:2008-06-26
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