Invention Grant
- Patent Title: Methods of crimping expandable medical devices
- Patent Title (中): 压缩可扩张医疗器械的方法
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Application No.: US11781180Application Date: 2007-07-20
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Publication No.: US07828916B2Publication Date: 2010-11-09
- Inventor: Sanjay Shrivastava
- Applicant: Sanjay Shrivastava
- Applicant Address: US CA Santa Clara
- Assignee: Abbott Cardiovascular Systems Inc.
- Current Assignee: Abbott Cardiovascular Systems Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Squire, Sanders & Dempsey, L.L.P.
- Agent Jonathan Feuchtwang
- Main IPC: C22F1/10
- IPC: C22F1/10
Abstract:
Disclosed are methods for crimping a medical device, such as a stent, wherein the medical device is formed of a superelastic alloy. A method for crimping a medical device includes cooling the stent until the alloy becomes martensitic, allowing the stent to warm after cooling, crimping the stent with a crimping apparatus.
Public/Granted literature
- US20080021543A1 Methods of Crimping Expandable Medical Devices Public/Granted day:2008-01-24
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