Invention Grant
- Patent Title: Method for manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component
- Patent Title (中): 多层陶瓷电子元件和多层陶瓷电子元件的制造方法
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Application No.: US12103089Application Date: 2008-04-15
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Publication No.: US07828919B2Publication Date: 2010-11-09
- Inventor: Daisuke Haga , Yoichiro Ito
- Applicant: Daisuke Haga , Yoichiro Ito
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-104454 20060405
- Main IPC: C03B29/00
- IPC: C03B29/00 ; B31B1/60 ; B44C1/165 ; B44C1/17 ; B29C65/00 ; B32B7/00 ; B32B9/00

Abstract:
A method for manufacturing a multilayer ceramic electronic component can prevent the occurrence of bubble trapping. In the method, when an external layer ceramic green sheet is pressure-bonded, for example, to a sheet made of a good quality paper having a rough surface, which is placed on a supporting member, followed by peeling off its carrier film, a first-layer ceramic green sheet is formed. The first-layer external layer ceramic green sheet uses a sterically hindered dispersing agent, such as an aryl ether polymer, as a dispersing agent. Since it is light in weight, the binder segregates at the upper side, and hence a C concentration changes in the thickness direction. More particularly, compared to a C concentration at a surface at a carrier film side supported by the carrier film, a C concentration at an open surface opposite to the surface at the carrier film side is about 1.5 to about 4.0 times.
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