Invention Grant
- Patent Title: Plating barrel, barrel plating apparatus and drain equipment
- Patent Title (中): 电镀桶，电镀设备和排水设备
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Application No.: US11476762Application Date: 2006-06-29
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Publication No.: US07828945B2Publication Date: 2010-11-09
- Inventor: Wataru Yamamoto
- Applicant: Wataru Yamamoto
- Applicant Address: JP Shibuya-Ku, Tokyo
- Assignee: Yamamoto-MS Co., Ltd
- Current Assignee: Yamamoto-MS Co., Ltd
- Current Assignee Address: JP Shibuya-Ku, Tokyo
- Agency: Squire, Sanders & Dempsey L.L.P.
- Priority: JP2003-172982 20030618
- Main IPC: B23H7/26
- IPC: B23H7/26
Abstract:
The present invention can provide 1 which barrel plating apparatus where a plating barrel has permeable holes and slits in a size of order of micrometers on the wall thereof. The plating barrel is fabricated with porous plastic materials which have permeable holes and slits to the plating liquid and no piece materials to be plated are dropped thereof. Further advantage of the present invention is to provide a drain tool to drain the plating liquid L staying in the plating barrel.
Public/Granted literature
- US20060243586A1 Plating barrel, barrel plating apparatus and drain equipment Public/Granted day:2006-11-02
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