Invention Grant
- Patent Title: Systems and methods for thermal actuation of microfluidic devices
- Patent Title (中): 微流体装置的热致动系统和方法
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Application No.: US10910255Application Date: 2004-08-02
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Publication No.: US07829025B2Publication Date: 2010-11-09
- Inventor: Karthik Ganesan , Kalyan Handique
- Applicant: Karthik Ganesan , Kalyan Handique
- Applicant Address: US CA San Jose US CA San Jose
- Assignee: Venture Lending & Leasing IV, Inc.,Venture Lending & Leasing V, Inc.
- Current Assignee: Venture Lending & Leasing IV, Inc.,Venture Lending & Leasing V, Inc.
- Current Assignee Address: US CA San Jose US CA San Jose
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: B01L3/02
- IPC: B01L3/02

Abstract:
A microfluidic processing device includes a substrate defining a microfluidic network. The substrate is in thermal communication with a plurality of N independently controllable components and a plurality of input output contacts for connecting the substrate to an external controller. Each component has at least two terminals. Each terminal is in electrical communication with at least one contact. The number of contacts required to independently control the N components is substantially less than the total number of terminals. Upon actuation, the components typically heat a portion of the microfluidic network and/or sense a temperature thereof.
Public/Granted literature
- US20050084424A1 Systems and methods for thermal actuation of microfluidic devices Public/Granted day:2005-04-21
Information query
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