Invention Grant
- Patent Title: Methods of uniformity control for low flow process and chamber to chamber matching
- Patent Title (中): 低流程和室到室匹配的均匀性控制方法
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Application No.: US12256405Application Date: 2008-10-22
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Publication No.: US07829145B2Publication Date: 2010-11-09
- Inventor: Ganesh Balasubramanian , Juan Carlos Rocha-Alvarez , Tom K. Cho , Daemian Raj
- Applicant: Ganesh Balasubramanian , Juan Carlos Rocha-Alvarez , Tom K. Cho , Daemian Raj
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the method for processing a substrate includes delivering a processing gas into a chemical vapor deposition chamber through a first gas pathway that includes flow through a first plurality of apertures in a blocker plate, the blocker plate creating a pressure drop of at least approximately 0.8 torr thereacross, reacting the processing gas to deposit a material on a substrate surface, removing the substrate from the chamber, delivering a cleaning gas into the chamber through a second gas pathway around the blocker plate bypassing the blocker plate and through a second plurality of apertures formed in the blocker plate, and reacting the cleaning gases with deposits within the chamber to etch the deposits from the chamber.
Public/Granted literature
- US20090047446A1 UNIFORMITY CONTROL FOR LOW FLOW PROCESS AND CHAMBER TO CHAMBER MATCHING Public/Granted day:2009-02-19
Information query
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