Invention Grant
US07829154B2 Particle deposition apparatus, particle deposition method, and manufacturing method of light-emitting device 失效
微粒沉积装置,颗粒沉积方法和发光装置的制造方法

  • Patent Title: Particle deposition apparatus, particle deposition method, and manufacturing method of light-emitting device
  • Patent Title (中): 微粒沉积装置,颗粒沉积方法和发光装置的制造方法
  • Application No.: US11665735
    Application Date: 2005-10-21
  • Publication No.: US07829154B2
    Publication Date: 2010-11-09
  • Inventor: Satoshi KobayashiYuki Iguchi
  • Applicant: Satoshi KobayashiYuki Iguchi
  • Applicant Address: JP Tokyo
  • Assignee: Hoya Corporation
  • Current Assignee: Hoya Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff & Berridge, PLC
  • Priority: JP2004-307226 20041021
  • International Application: PCT/JP2005/019377 WO 20051021
  • International Announcement: WO2006/043656 WO 20060427
  • Main IPC: B05D1/06
  • IPC: B05D1/06 B05B5/16
Particle deposition apparatus, particle deposition method, and manufacturing method of light-emitting device
Abstract:
To provide a (homogeneous) particle deposit without any impurity contamination, on which only particles with a desired size are deposited. A solution, with particles dispersed in a solvent, is jetted as a flow of fine liquid droplets from a tip part of a capillary, and the jetted fine liquid droplets are electrically charged. This flow of the droplets is introduced into a vacuum chamber through a jet nozzle, as a free jet flow. The free jet flow that travels in the vacuum chamber is introduced into an inside of a deposition chamber, inside of which is set at lower pressure, through a skimmer nozzle provided in the deposition chamber, as an ion beam. Subsequently, by an energy separation device, only particles having particular energy are selected from the electrically charged particles in the flow, and are deposited on a deposited body disposed in an inside of the deposition chamber.
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