Invention Grant
- Patent Title: Porous films with chemical resistance
- Patent Title (中): 具耐化学性的多孔薄膜
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Application No.: US10572548Application Date: 2004-09-15
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Publication No.: US07829186B2Publication Date: 2010-11-09
- Inventor: Yo Yamato , Michio Tsuyumoto
- Applicant: Yo Yamato , Michio Tsuyumoto
- Applicant Address: JP Osaka
- Assignee: Daicel Chemical Industries, Ltd.
- Current Assignee: Daicel Chemical Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2003-334108 20030925
- International Application: PCT/JP2004/013860 WO 20040915
- International Announcement: WO2005/030849 WO 20050407
- Main IPC: B32B3/26
- IPC: B32B3/26 ; B32B3/00

Abstract:
A porous film with chemical resistance of this invention includes a porous film base covered with a chemical-resistant polymeric compound and has a multiplicity of communicating micropores having an average pore size of 0.01 to 10 μm. The chemical-resistant polymeric compound can be, for example, any of phenolic resins, urea resins, melamine resins, benzoguanamine resins, polyimide resins, epoxy resins, benzoxazine resins, polypropylene resins, polyurethane resins, fluororesins, alkyd resins, cellulose acetate resins, phthalic resins, maleic resins, and silicone resins.
Public/Granted literature
- US20070036959A1 Porous films with chemical resistance Public/Granted day:2007-02-15
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