Invention Grant
US07829259B2 Resin for photoresist composition, photoresist composition and method for forming resist pattern
有权
用于光致抗蚀剂组合物的树脂，光致抗蚀剂组合物和形成抗蚀剂图案的方法
- Patent Title: Resin for photoresist composition, photoresist composition and method for forming resist pattern
- Patent Title (中): 用于光致抗蚀剂组合物的树脂，光致抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US12365752Application Date: 2009-02-04
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Publication No.: US07829259B2Publication Date: 2010-11-09
- Inventor: Hideo Hada , Masaru Takeshita , Shogo Matsumaru , Hiroaki Shimizu
- Applicant: Hideo Hada , Masaru Takeshita , Shogo Matsumaru , Hiroaki Shimizu
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2003-160478 20030605; JP2003-428853 20031225; JP2004-057449 20040302
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/028 ; C08F2/38
Abstract:
A resin for photoresist compositions is disclosed with excellent resolution and line edge roughness characteristics. A photoresist composition and a method for forming a resist pattern using such a resin are also disclosed. The resin has a hydroxyl group bonded to a carbon atom at a polymer terminal, and the carbon atom in the α-position to the hydroxyl group has at least one electron attractive group.
Public/Granted literature
- US20090142700A1 RESIN FOR PHOTORESIST COMPOSITION, PHOTORESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN Public/Granted day:2009-06-04
Information query
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