Invention Grant
US07829263B2 Exposure method and apparatus, coating apparatus for applying resist to plural substrates, and device manufacturing method
有权
曝光方法和装置,用于对多个基板施加抗蚀剂的涂布装置以及装置制造方法
- Patent Title: Exposure method and apparatus, coating apparatus for applying resist to plural substrates, and device manufacturing method
- Patent Title (中): 曝光方法和装置,用于对多个基板施加抗蚀剂的涂布装置以及装置制造方法
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Application No.: US11567311Application Date: 2006-12-06
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Publication No.: US07829263B2Publication Date: 2010-11-09
- Inventor: Tetsuji Kazaana
- Applicant: Tetsuji Kazaana
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Cowan, Liebowitz & Latman, P.C.
- Priority: JP2005-354019 20051207; JP2006-273904 20061005
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G06F19/00 ; G03B27/32

Abstract:
Disclosed are an exposure method and apparatus, a coating apparatus and a device manufacturing method, wherein, in one preferred form, the exposure method is used to expose a resist having been applied onto a substrate by one of a plurality of resist coating units, and it includes a selecting step for choosing an exposure amount pattern that represents exposure amounts corresponding to a plurality of shots on the substrate, respectively, on the basis of a resist coating unit data that specifies which unit among the plurality of resist coating units should be used to apply a resist onto the substrate, and an exposure step for exposing the resist on the substrate in accordance with the exposure amount pattern chosen by the selecting step.
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