Invention Grant
- Patent Title: Supply mechanism for the chuck of an integrated circuit dicing device
- Patent Title (中): 集成电路切割装置卡盘的供电机构
-
Application No.: US11660940Application Date: 2005-08-23
-
Publication No.: US07829383B2Publication Date: 2010-11-09
- Inventor: Hae Choon Yang
- Applicant: Hae Choon Yang
- Applicant Address: SG Singapore
- Assignee: Rokko Systems Pte Ltd.
- Current Assignee: Rokko Systems Pte Ltd.
- Current Assignee Address: SG Singapore
- Agency: Dickstein Shapiro LLP
- Priority: SG200405166-0 20040823; SG200501802-3 20050322; SG200505056-2 20050715
- International Application: PCT/SG2005/000288 WO 20050823
- International Announcement: WO2006/022597 WO 20060302
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).
Public/Granted literature
- US20080213975A1 Supply Mechanism For the Chuck of an Integrated Circuit Dicing Device Public/Granted day:2008-09-04
Information query
IPC分类:
