Invention Grant
- Patent Title: Silicon carbide semiconductor device and method for producing the same
- Patent Title (中): 碳化硅半导体器件及其制造方法
-
Application No.: US12443210Application Date: 2008-08-01
-
Publication No.: US07829416B2Publication Date: 2010-11-09
- Inventor: Chiaki Kudou , Kazuya Utsunomiya , Masashi Hayashi
- Applicant: Chiaki Kudou , Kazuya Utsunomiya , Masashi Hayashi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2007-205204 20070807
- International Application: PCT/JP2008/002073 WO 20080801
- International Announcement: WO2009/019837 WO 20090212
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A gate electrode 18 formed on a silicon carbide substrate 11 includes a silicon lower layer 18A and a silicide upper layer 18B provided on the silicon lower layer 18A, the silicide upper layer 18B being made of a compound of a first metal and silicon. A source electrode 1as formed on the surface of the silicon carbide substrate 11 and in contact with an n type source region and a p+ region contains second metal silicide different from the first metal silicide. Side faces of the silicon lower layer 18A are covered with an insulator.
Public/Granted literature
- US20100075474A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2010-03-25
Information query
IPC分类: