Invention Grant
- Patent Title: Semiconductor apparatus and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US12155530Application Date: 2008-06-05
-
Publication No.: US07829418B2Publication Date: 2010-11-09
- Inventor: Yasuhiko Ueda , Hiroyuki Fujimoto
- Applicant: Yasuhiko Ueda , Hiroyuki Fujimoto
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JPP2007-151597 20070607
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor apparatus including a trench gate transistor having at least an active region surrounded by a device isolation insulating film; a trench provided by bringing both ends thereof into contact with the device isolation insulating film in the active region; a gate electrode formed in the trench via a gate insulating film; and a diffusion layer formed close to the trench; on a semiconductor substrate, and also includes an opening portion positioned on one surface of the semiconductor substrate; a pair of first inner walls positioned in a side of the device isolation insulating film and connected with the opening portion; a pair of second inner walls positioned in a side of the active region and connected with the opening portion; and a bottom portion positioned opposite to the opening portion and connected with the first inner walls and the second inner walls, wherein a cross sectional outline of the second inner wall is substantially linear, and a burr generated inside the trench is removed or reduced.
Public/Granted literature
- US20080303086A1 Semiconductor apparatus and method for fabricating the same Public/Granted day:2008-12-11
Information query
IPC分类: