Invention Grant
- Patent Title: Method for dividing wafer, method for manufacturing silicon devices, and method for manufacturing liquid ejecting heads
- Patent Title (中): 分割晶片的方法，硅器件的制造方法以及液体喷射头的制造方法
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Application No.: US11937318Application Date: 2007-11-08
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Publication No.: US07829446B2Publication Date: 2010-11-09
- Inventor: Wataru Takahashi , Yoshinao Miyata , Kazushige Umetsu , Yutaka Yamazaki
- Applicant: Wataru Takahashi , Yoshinao Miyata , Kazushige Umetsu , Yutaka Yamazaki
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2006-304586 20061109
- Main IPC: H01L21/425
- IPC: H01L21/425
Abstract:
A method for dividing a wafer into a plurality of chips is provided. The method includes providing recesses in a surface of the wafer at positions along boundaries between regions to become the individual chips, providing fragile portions having a predetermined width inside the wafer at positions along the boundaries by irradiation of the other surface of the wafer with a laser beam whose condensing point is placed inside the wafer, the fragile portions including connected portions at least at one of the surfaces of the wafer, and dividing the wafer at the fragile portions into the individual chips by applying an external force to the wafer.
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