Invention Grant
US07829453B2 Method for forming solder balls with a stable oxide layer by controlling the reflow ambient
有权
通过控制回流环境形成具有稳定氧化物层的焊球的方法
- Patent Title: Method for forming solder balls with a stable oxide layer by controlling the reflow ambient
- Patent Title (中): 通过控制回流环境形成具有稳定氧化物层的焊球的方法
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Application No.: US11531437Application Date: 2006-09-13
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Publication No.: US07829453B2Publication Date: 2010-11-09
- Inventor: Gotthard Jungnickel , Alexander Platz , Frank Kuechenmeister
- Applicant: Gotthard Jungnickel , Alexander Platz , Frank Kuechenmeister
- Applicant Address: KY Grand Cayman
- Assignee: Globalfoundries Inc.
- Current Assignee: Globalfoundries Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Williams, Morgan & Amerson, P.C.
- Priority: DE102005057058 20051130; DE102006001254 20060110
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
By controlling the cooling rate during the oxidation process for forming an oxide layer on solder balls and by selecting an elevated temperature as an initial temperature of the oxidation process, a reliable yet easily removable oxide layer may be obtained. Consequently, yield losses during the flip chip assembly process may be significantly reduced.
Public/Granted literature
- US20070123020A1 METHOD FOR FORMING SOLDER BALLS WITH A STABLE OXIDE LAYER BY CONTROLLING THE REFLOW AMBIENT Public/Granted day:2007-05-31
Information query
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