Invention Grant
US07829459B2 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device
有权
在半导体集成电路器件中捆扎两个多晶硅线的方法和装置
- Patent Title: Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device
- Patent Title (中): 在半导体集成电路器件中捆扎两个多晶硅线的方法和装置
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Application No.: US12542605Application Date: 2009-08-17
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Publication No.: US07829459B2Publication Date: 2010-11-09
- Inventor: Michael James Heinz
- Applicant: Michael James Heinz
- Applicant Address: US CA Sunnyvale
- Assignee: Silicon Storage Technology, Inc.
- Current Assignee: Silicon Storage Technology, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: DLA Piper LLP (US)
- Main IPC: H01L23/528
- IPC: H01L23/528

Abstract:
A method and apparatus for partially strapping two polysilicon lines, each having a first end and second end, uses a metal line having a plurality of spaced apart metal segments with each metal segment partially strapping a different portion of a polysilicon line. The metal segments are arranged from the first end to the second end with the signals propagating from the second end to the first end. Where two metal segments are used, the segments have lengths of x = 2 L 7 and L-X where L is the length between the first end and the second end. Where three segments are used, the segments have lengths of X=0.25 L, Y=0.48 L, and Z=0.27 L.
Public/Granted literature
- US20100081270A1 Method and Apparatus for Strapping Two Polysilicon Lines in a Semiconductor Integrated Circuit Device Public/Granted day:2010-04-01
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