Invention Grant
US07829480B2 PCB supporting woven fabric and a PCB having the same 有权
PCB支撑织物和具有该PCB的PCB

PCB supporting woven fabric and a PCB having the same
Abstract:
The present invention is to provide a printed circuit board (PCB) supporting woven fabric and a PCB having the same. The PCB includes a supporting woven fabric, a filling resin body enveloping the supporting woven fabric and at least one signal trace arranged on the surface of the filling resin body. The supporting woven fabric is made by a number of warp fiberglass strands and weft fiberglass strands interlaced mutually, wherein each of the warp fiberglass strands initially crosses above one weft fiberglass strand to separately form a bump upwardly and passes through under the next at least two weft fiberglass strands. The invention aims to decrease the number of the bumps bulged thereof to make the PCB improved in effectiveness and speed of signal transmission.
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