Invention Grant
- Patent Title: PCB supporting woven fabric and a PCB having the same
- Patent Title (中): PCB支撑织物和具有该PCB的PCB
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Application No.: US12010375Application Date: 2008-01-24
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Publication No.: US07829480B2Publication Date: 2010-11-09
- Inventor: Mu-Chih Chuang
- Applicant: Mu-Chih Chuang
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: CKC & Partners Co., Ltd.
- Main IPC: B32B15/14
- IPC: B32B15/14 ; B32B17/04 ; H05K1/03 ; H05K7/02

Abstract:
The present invention is to provide a printed circuit board (PCB) supporting woven fabric and a PCB having the same. The PCB includes a supporting woven fabric, a filling resin body enveloping the supporting woven fabric and at least one signal trace arranged on the surface of the filling resin body. The supporting woven fabric is made by a number of warp fiberglass strands and weft fiberglass strands interlaced mutually, wherein each of the warp fiberglass strands initially crosses above one weft fiberglass strand to separately form a bump upwardly and passes through under the next at least two weft fiberglass strands. The invention aims to decrease the number of the bumps bulged thereof to make the PCB improved in effectiveness and speed of signal transmission.
Public/Granted literature
- US20090191377A1 PCB supporting woven fabric and a PCB having the same Public/Granted day:2009-07-30
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