Invention Grant
- Patent Title: Reactive hot melt adhesives
- Patent Title (中): 活性热熔胶
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Application No.: US10457260Application Date: 2003-06-09
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Publication No.: US07829615B2Publication Date: 2010-11-09
- Inventor: Andrew Trevithick Slark
- Applicant: Andrew Trevithick Slark
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski; Steven C. Bauman
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09D11/10 ; C08F8/30 ; C08L75/00
Abstract:
Reactive hot melt adhesives with long open time and/or high green strength prepared by using an acrylic polymer component containing a high molecular weight acrylic polymer.
Public/Granted literature
- US20040249076A1 Novel reactive hot melt adhesives Public/Granted day:2004-12-09
Information query
