Invention Grant
- Patent Title: Method for the production of a packaging made of thermoformable film having high thermal stability and a vapour barrier
- Patent Title (中): 用于制造具有高热稳定性和蒸气阻隔性的可热成膜的包装的方法
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Application No.: US10527659Application Date: 2003-09-11
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Publication No.: US07829633B2Publication Date: 2010-11-09
- Inventor: Dirk Heukelbach , Ekkehard Beer
- Applicant: Dirk Heukelbach , Ekkehard Beer
- Applicant Address: DE Kelsterbach
- Assignee: TICONA GmbH
- Current Assignee: TICONA GmbH
- Current Assignee Address: DE Kelsterbach
- Agency: Connolly Bove Lodge & Hutz LLP
- Priority: DE10242730 20020913
- International Application: PCT/EP03/10077 WO 20030911
- International Announcement: WO2004/026946 WO 20040401
- Main IPC: C08F8/00
- IPC: C08F8/00 ; C08F10/00 ; C08F32/08 ; C08F36/00 ; C08F132/08 ; C08L45/00 ; B32B27/08 ; B32B27/32
Abstract:
A process for producing packaging composed of thermoformable film composed of thermoplastic polyolefins provides the thermoforming of the film at temperatures in the range from 70 to 170° C., thus giving packaging which has a high heat distortion temperature in the range from 60 to 200° C. and which has a high water-vapor barrier. The thermoformable film comprises an amount in the range from 5 to 100% by weight of COC with a glass transition temperature Tg in the range from 65 to 200° C.
Public/Granted literature
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