Invention Grant
- Patent Title: Composition for conductive layers in electronic devices
- Patent Title (中): 电子设备中导电层的组成
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Application No.: US11661364Application Date: 2005-09-02
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Publication No.: US07829639B2Publication Date: 2010-11-09
- Inventor: Koichi Terao , Yuji Shinohara , Takashi Shinohara
- Applicant: Koichi Terao , Yuji Shinohara , Takashi Shinohara
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-255282 20040902
- International Application: PCT/JP2005/016570 WO 20050902
- International Announcement: WO2006/025611 WO 20060309
- Main IPC: C07D249/12
- IPC: C07D249/12 ; C07D271/10 ; C07D301/28 ; C07D333/50 ; C07D409/14 ; B32B27/38 ; C08L63/00

Abstract:
A composition for conductive materials comprises a compound represented by the following general formula (A1): wherein: R1 is the same or different and each independently represents a C2-C8 straight-chain alkyl group; R2 is the same or different and each independently represents a hydrogen atom, a methyl group or an ethyl group; Y represents a group containing at least one substituted or unsubstituted aromatic hydrocarbon ring, or substituted or unsubstituted heterocyle; and X1 is the same or different and each represents a substituent represented by the following general formula (A2): wherein n1 is an integer of from 2 to 8.
Public/Granted literature
- US20070286997A1 Material Composition for Conductive Layers in Electronic Devices Public/Granted day:2007-12-13
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